Hi Technetters!!!

Here's one for you.

We have an assembly with an area under a copper shield that must be filled
with RTV. It is important that there are no voids in the fill. We can only
fill from an open end and thus have to work a needle down to the bottom, and
fill from that point, withdraw the needle and hope it all settles in before
curing.

The shield is about 1 cm long, .5 cm wide and .2 cm off of the board the
open end is .2 cm by .5 cm. It is soldered onto the board along the bottom
and the closed end must remain that way. To disassemble is to destroy the
part. The board is 1.5 - 1.6 mm  FR-4.

Is there any way to assure that there are no voids that is not destructive,
such as Scanning Acoustic Microscopy?

Thanks in advance

Regards,
Sherman Banks
Finisar Corp.
1308 Moffett Park Drive
Sunnyvale, CA 94089
408/548-0940
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