In a message dated 02/17/2000 12:09:39 AM Central Standard Time, 
[log in to unmask] writes:

<< Not sure what it stands for actually myself, but I will find out now. It's 
a
 5Ghz QFP type device, that sits FLAT on the pcb. There are no legs or balls
 of any description, just a mirror image of the pad. In the middle of the
 device, (it's about 15mmx15mm) is a large pad about 6mmx6mm which is used as
 a heat sink, but this is also flush and also has to be soldered.
 
 Hope this describes it. Not very technical I know.
 
 John >>

Hi John!

After Joyce asked if it was an Amkor device, I went to their web page and 
viola'! I found out what a MLFP is. Stands for; MicroLeadFrame™ Package. It 
is a Amkor trademarked package. Go to:

http://www.amkor.com/assembly_and_test/products/chipscale/mlp/microleadframepa
ckage.htm

Looking at the data sheet for the part (if I'm reading it right), the I/O 
pads are only 1.65mm X 1.65mm (.0065" X .0065")! Now that's getting tiny! No 
wonder the vendor wasn't much help...them telling you to get a 5 or 6-mil 
stencil was wrong, I don't think you'll be able to get paste through openings 
that small with a stencil that thick. I would be thinking more along the 
lines of 3-4 mils.

Anyways, as you can tell, I've never soldered a MLFP™, so I can't tell you 
about voiding or anything. But if the dimensions of the pads are what I think 
they, a 5-6-mil stencil will be too thick...

-Steve Gregory-

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