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February 2000

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Subject:
From:
Balakrishnan Gopalan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 Feb 2000 05:58:20 -0800
Content-Type:
text/plain
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text/plain (32 lines)
Hello Technetters,
I am a student with State University of New York. I
was wondering if any of you are or have implemented
Heatsink or Heat spreader attach using any kind of
interface material. Got a bunch of queries related to
process and reliability concerns. I did post a couple
of them a few weeks back which apparently did not draw
any response. So if there is anyone who is familiar
with this, it would be of great help.
Thanks in advance
Balki
Graduate Research Associate
State University of New York, Binghamton
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