John, Is that the AMKOR device?
                                      jk
At 05:08 PM 2/17/00 +1100, you wrote:
>Not sure what it stands for actually myself, but I will find out now. It's a
>5Ghz QFP type device, that sits FLAT on the pcb. There are no legs or balls
>of any description, just a mirror image of the pad. In the middle of the
>device, (it's about 15mmx15mm) is a large pad about 6mmx6mm which is used as
>a heat sink, but this is also flush and also has to be soldered.
>
>Hope this describes it. Not very technical I know.
>
>John
>
>-----Original Message-----
>From:   TechNet [mailto:[log in to unmask]] On Behalf Of Stephen R. Gregory
>Sent:   Thursday, 17 February 2000 2:15 PM
>To:     [log in to unmask]
>Subject:        Re: [TN] MLFP's
>
>In a message dated 02/16/2000 8:34:39 PM Central Standard Time,
>[log in to unmask] writes:
>
>> Guys,
>>
>>  We have a requirement to run this package in fairly small runs. Anyone
>had
>>  any experience with these that they could share? I am particularly
>>  interested in issues such as presence of voids on heat transfer pad
>solder,
>>  stencil aperture design, reflow characteristics. Any info or even
>potential
>>  sources of info would be greatly appreciated. The data supplied by vendor
>>  was not really much help, only with the only suggestion being use either
>a
>5
>>  or 6mil stencil.
>>
>>  Thanks
>>
>>  John Harris
>>  Process Engineer
>>  AEMS Pty Ltd
>
>Hi John!
>
>I guess this is one of them deals that if you have to ask what a MLFP is,
>then one won't be of much help...but I do have to ask, what is a MLFP? This
>is another of the myriad of acronyms that I'm not familiar with. Let us know
>what that is.
>
>Stencil thickness and aperture design is pretty straight forward provided
>you
>know what package you're dealing with...excuse me for my ignorance, but I
>don't know what a MLFP is....
>
>-Steve Gregory-
>
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