Not sure what it stands for actually myself, but I will find out now. It's a
5Ghz QFP type device, that sits FLAT on the pcb. There are no legs or balls
of any description, just a mirror image of the pad. In the middle of the
device, (it's about 15mmx15mm) is a large pad about 6mmx6mm which is used as
a heat sink, but this is also flush and also has to be soldered.

Hope this describes it. Not very technical I know.

John

-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Stephen R. Gregory
Sent:   Thursday, 17 February 2000 2:15 PM
To:     [log in to unmask]
Subject:        Re: [TN] MLFP's

In a message dated 02/16/2000 8:34:39 PM Central Standard Time,
[log in to unmask] writes:

> Guys,
>
>  We have a requirement to run this package in fairly small runs. Anyone
had
>  any experience with these that they could share? I am particularly
>  interested in issues such as presence of voids on heat transfer pad
solder,
>  stencil aperture design, reflow characteristics. Any info or even
potential
>  sources of info would be greatly appreciated. The data supplied by vendor
>  was not really much help, only with the only suggestion being use either
a
5
>  or 6mil stencil.
>
>  Thanks
>
>  John Harris
>  Process Engineer
>  AEMS Pty Ltd

Hi John!

I guess this is one of them deals that if you have to ask what a MLFP is,
then one won't be of much help...but I do have to ask, what is a MLFP? This
is another of the myriad of acronyms that I'm not familiar with. Let us know
what that is.

Stencil thickness and aperture design is pretty straight forward provided
you
know what package you're dealing with...excuse me for my ignorance, but I
don't know what a MLFP is....

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################