In a message dated 02/16/2000 8:34:39 PM Central Standard Time,
[log in to unmask] writes:

> Guys,
>
>  We have a requirement to run this package in fairly small runs. Anyone had
>  any experience with these that they could share? I am particularly
>  interested in issues such as presence of voids on heat transfer pad solder,
>  stencil aperture design, reflow characteristics. Any info or even potential
>  sources of info would be greatly appreciated. The data supplied by vendor
>  was not really much help, only with the only suggestion being use either a
5
>  or 6mil stencil.
>
>  Thanks
>
>  John Harris
>  Process Engineer
>  AEMS Pty Ltd

Hi John!

I guess this is one of them deals that if you have to ask what a MLFP is,
then one won't be of much help...but I do have to ask, what is a MLFP? This
is another of the myriad of acronyms that I'm not familiar with. Let us know
what that is.

Stencil thickness and aperture design is pretty straight forward provided you
know what package you're dealing with...excuse me for my ignorance, but I
don't know what a MLFP is....

-Steve Gregory-

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