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February 2000

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Subject:
From:
John Harris <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 Feb 2000 13:33:25 +1100
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Guys,

We have a requirement to run this package in fairly small runs. Anyone had
any experience with these that they could share? I am particularly
interested in issues such as presence of voids on heat transfer pad solder,
stencil aperture design, reflow characteristics. Any info or even potential
sources of info would be greatly appreciated. The data supplied by vendor
was not really much help, only with the only suggestion being use either a 5
or 6mil stencil.

Thanks

John Harris
Process Engineer
AEMS Pty Ltd

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