Copper traces sometimes crack due to mechanical bending/flexing or thermal
expansion mismatch. Do you know any modeling works on this issue?
Generally, how do substrate suppliers and packaging houses decide the
minimum trace width to prevent trace cracking under these situations?

Thanks,

Yuan Li
Research Associate
CAMPmode (Center For Advanced Manufacturing and Packaging of Microwave,
Optical and Digital Electronics)
University of Colorado at Boulder
CB 427, Boulder, CO 80309-0427

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