hi,

i beg your pardon.  after a good night's sleep, i re-read this email.  i'm
wrong; i think he wanted what you gave him.

phil

-----Original Message-----
From: rampinc [mailto:[log in to unmask]]
Sent: Tuesday, February 01, 2000 6:26 PM
To: [log in to unmask]
Subject: Re: [TN] BGA-Multi layer ceramic design


Sullivan,
Here is another location you will find the information to design PCB with
BGA packages.
Go to the site -
http://www.mot-sps.com/solutions/wired/pbga

Like Intel site, this all technical with good data.

"Sullivan, William" wrote:

> Fellow TechNeter's
>
>         I am in sort of a dilemma, I have been AR'ed to develop a design
> process for BGA (multi layer ceramic) packages. Up to this point we have
out
> source the design and fabrication but this is very costly and turn times
are
> unacceptable in the semiconductor industry. I consider myself a seasoned
PCB
> designer with the proper EDA tools in place to aid me, but this is out of
my
> league at the present moment.  I could really use some help on gathering
> design guide information,routing, and fabrication on these things. Or
> possibly some one out there that is doing package design can contact me
with
> there phone number.
>
>         Thanks William Sullivan C.I.D
>         Supervisor Probe Card Design
>
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--
____________________________________
Regards,
Pratap Singh

Tel./Fax: 512-255-6820,
e-mail: [log in to unmask] or [log in to unmask]

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