Hello Technet,

I was wondering, is anybody out there doing 0.8 mm pitch BGA's on boards that have to meet the IPC class 3 assembly requirements ?  My concern is that with the thinner stencil that's needed to print the solder paste for these FBGA's, there will be not enough solder for some of the other components.
I think that a step-etched stencil is no option, since there is not enough free area around the FBGA.

By the way, does anyone have experience with the behaviour of fine-pitch BGA's during shock and vibration ?

Hope to hear from some of you !

Daan Terstegge
Unclassified mail
visit my website: http://surf.to/smtinfo

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################