Murugan
        We have done this a lot in the past and we have found some times the
glue has failed on very heavy parts, not always but has happened where a
large part has fallen off at reflow. I think it may have to do with the flux
contaminating the surface where the glue is and causes it not to stick well.
For the most part gluing parts onto solderside is not necessary, with an
exception of large inductors and metal heat sink qfp's. In conclusion you
should wash after reflow and then glue and cure to be safe, but you can get
away with it if the constraint is larger than a possible cost of a defect
happening.

Bob

-----Original Message-----
From: Murugan Vasudevan [mailto:[log in to unmask]]
Sent: February 15, 2000 7:24 AM
To: [log in to unmask]
Subject: [TN] Cure and Reflow


Hi Technetters,

Just wondering if anyone of you have done simultaneous
cure of SMD adhesives and reflow of solder paste in
the same pass. Any information/leads on any previous
experiences with this process will be very helpful.

Thanks,

Murugan.
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