My team has been very successful using this process to avoid solder skips on
boards with wave solder design rule violations.  Incidentally, I run a
temperature profile with a marginal time above liquidus to maintain
throughput in a very short four zone oven.  The fresh, albeit grainy, solder
joints wet nicely in the wave and the final results are excellent.
Regards,
Brad


-----Original Message-----
From: Murugan Vasudevan [mailto:[log in to unmask]]
Sent: Tuesday, February 15, 2000 7:24 AM
To: [log in to unmask]
Subject: [TN] Cure and Reflow


Hi Technetters,

Just wondering if anyone of you have done simultaneous
cure of SMD adhesives and reflow of solder paste in
the same pass. Any information/leads on any previous
experiences with this process will be very helpful.

Thanks,

Murugan.
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