Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 15 Feb 2000 10:58:39 -0500 |
Content-Type: | text/plain |
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Yes Murugan,
I do it without the slightest problem.
There are a couple of things related to this:
-make sure the components are inserted with sufficient pressure the make a
good contact with the solder, sine the adhesive cures faster and it will
hold the component higher when the paste melts
-make sure the insertion is accurate, because no self alignment of the
component will happen in the oven for the same reason, the adhesive cures
faster.
Regards,
Ioan
> -----Original Message-----
> From: Murugan Vasudevan [SMTP:[log in to unmask]]
> Sent: Tuesday, February 15, 2000 10:24 AM
> To: [log in to unmask]
> Subject: [TN] Cure and Reflow
>
> Hi Technetters,
>
> Just wondering if anyone of you have done simultaneous
> cure of SMD adhesives and reflow of solder paste in
> the same pass. Any information/leads on any previous
> experiences with this process will be very helpful.
>
> Thanks,
>
> Murugan.
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