In a message dated 02/15/2000 10:31:06 AM US Eastern Standard Time,
[log in to unmask] writes:

>
>  Just wondering if anyone of you have done simultaneous
>  cure of SMD adhesives and reflow of solder paste in
>  the same pass. Any information/leads on any previous
>  experiences with this process will be very helpful.
>

From my experience with troubleshooting client's processes, it is a very bad
idea.  You have too great a chance of mixing curing or outgassing products
from the adhesive with flux residues from the paste.  The two residues can
interact with each other to form a detrimental combination.  I published two
case studies on a common detrimental effect in my Process Rx column in
Circuits Assembly magazine - "Microcanyons" and "Become one with the Glue".

Doug Pauls
Technical Director, CSL

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################