Hi all,

I have a couple questions regarding dbl-sided BGA assembly and underfill
...

1)  Would the process typically be ...
Reflow Side 1 > Underfill Side 1 > Reflow Side 2 > Underfill Side 2
or
Reflow Side 1 > Reflow Side 2 > Underfill Sides 1 & 2?

2)  Do any of you have a recommendation for underfill material(s) that
you use and work well?

Best regards,
Ed Hare
VM SEM Lab, Inc.

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