Steve:

Nothing is simple. However, tape testing over traces and also on laminate
should eliminate worries about overall failure of the mask under question.

Depending on the size of the vias, most mask do not have the cohesive
strenght to large "vias". The word large has to be defined based on mask
thickness, process and specific mask under consideration.

Sometimes, additional UV cure  or thermal cure can help improve the cohesive
strenght. Howeveer, overbaking or UV curing can lead to mask embrittlement
with concomittant loss of adhesion.

If there is a real concern and via plugging is required, there are better
ways to that than with either LPSM, UV or thermally cured soldermasks.

Leo Roos

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