TECHNET Archives

February 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Feb 2000 18:11:03 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (85 lines)
In a message dated 02/10/2000 4:47:52 PM Central Standard Time, 
[log in to unmask] writes:

<< As a contract manufacturer, we recently have asked if we had any
      problems when assembling PCB's that have been constructed using
      "GTek".
 
      Does anyone have any assembly experience regarding "localized heat" or
      using "press fit connectors" on this material?
 
      Is there any other properties that I should be aware of when I am
      assembling components on these boards? (Board bowing, hydroscopic
      properties that limit the board from going through the wash)
 
      Thank you for any input
 
      Rob Green >>

Hi Rob!

Go to: http://www.ge.com/electromaterials/products.htm#getek and you'll find 
some info about it. Looks to me like you would handle Getek boards the same 
way as any
other board. Looks to me like it's just a different high Tg laminate. Heck I 
may have built some boards that were Getek and didn't know it...below I 
pasted some stuff from the page...

-Steve Gregory-

Overview 

GE Electromaterials manufactures and supplies laminates and prepregs for the 
printed circuit board industry. Our materials offer a cost effective and 
efficient option to meeting your demands.
 
GETEK® Thin Laminates (ML200), Rigid Laminates (RG200) and Prepregs 
(T-Series)  

GETEK® laminates and prepregs are patented products composed of epoxy and 
polyphenylene oxide (PPO®) resins. They offer the improved thermal and 
electrical properties needed for sophisticated circuitry - along with 
processability and significant cost savings. GETEK® materials can easily 
replace BT/Epoxy, Cyanate Ester, Polyimides, PTFE (Teflon®), and other 
substrates in many existing applications.
 
Benefits: 

Performance:
• Low and stable dielectric constant and dissipation factors
• Low moisture absorption
• High UL maximum operating temperature
• High Tg
• Low Z-axis expansion
• Superior crack resistance during thermal cycling

Processability: 

• Better dimensional stability 
• Tighter thickness control 
• Consistent results of one formulation 
• Processable with modified FR4 methodology 
• Superior craze resistance 
• Naturally UV-blocking; Fluorescent for AOI
 
The Result: 
 
Performance that matches higher-priced materials, easier processing than 
conventional high performance products and low material cost. It adds up to 
make GETEK® laminates the most cost efficient solution for high-end 
applications involving impedance control, high frequency and burn-in boards.  

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2