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February 2000

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From:
Carey Pico <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 Feb 2000 19:38:18 -0800
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Ken

It depends on the kind of component/device you want to trim.  The big
companies in the US are ESI and GSI (General Scanning...it may have changed
names a bit when it aquired Lumonics...maybe to GLSI).  They control some
90% of the US market.  The ESI/GSI markets tend to separate depending on the
commercial application.  This probably means each has their own strengths
and weaknesses.  The GSI systems tend to be faster/cheaper for the general
products, but at cost of measurement values.  But GSI is very good at what
they do.  ESI systems tend to be slower, but not in all cases, especially
with active devices.  ESI has a patented 1.3um laser that does not interfere
with Si devices during trimming.  But advantages come with a high cost.
Uptime is a significant issue, depending on the model.

So check them both out.

Carey


-----Original Message-----
From: Ken Fong <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Tuesday, February 08, 2000 5:39 PM
Subject: [TN] Laser trimming


>     Technetters,
>
>     Could anyone advise any information(companies, websites, or articles)
>     regarding the process, equipment, pros and cons of using laser
>     trimming in electronic products? Thanks.
>
>     Regards,
>     KenF, Feb 9,00
>
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