TECHNET Archives

February 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Michael Forrester <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 Feb 2000 16:18:31 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
I have a questions about the pad size needed for a BGA device. We are using a 25
mil 10/90 balls on an organic substrate (FR4).
 We currently have 20 mil, non-solder mask defined, pads on both the device and
PCB.  What is the recommended  pad size?  We
have control over the pad size on the device and PCB.  Thank you.

Best Regards,

Mike Forrester

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2