Hi
Here is some precisions that could maybe help you to help me !!

*  Gold plating thickness : Minimum 0.000030 in

*  Gold hardness: 130-200 Knoop

*  Under plate type and thickness :  Minimum 0.000100 in of Ni on 0.001 in
of Cu

* Office environment and no lubricant

Is it also possible for you to tell me where does your data come from
(25-100 insertions) ?
Does it come from the connectors datasheets ? If so, is it related to
`spring` resistance only or gold abrasion on PCB or both ??

Thank in advance for your collaboration

Alain

______________________________
At 10:51 PM 2/4/2000 -0800, you wrote:
>  Alain,
>The number of insertion life for a gold contact systems depends upon the
>following factors-   Gold plating thickness   Type of gold soft vs hard
>Under plate type and thickness   Contact spring material ( BeCu,
>Phophorbronze etc.)   Contact force (affects insertion force and wear)
>Contact geometry   Use of contact lubrication   Contact cleanliness (
>debris and particulate matter)   Plating porosity   Use environment (
>temperature, humidity, gases, vibration etc.) <  25 -100 insertions before
>contact resistance degradation. Alain Giguere wrote: Do you know what is
>the maximum number of insertions a gold contact (on a
>PCB) can hold until it is no longer reliable (or wears out)?
>_______________________________________________ Alain Giguere
>Quality Department
>Matrox Electronic Systems LTD. Tel: (514) 969-6000 ext.2978
>e-mail: [log in to unmask]
  --
>____________________________________
>Regards,
>Pratap Singh Tel./Fax: 512-255-6820,
>e-mail: [log in to unmask] or [log in to unmask]
>

Do you know what is the maximum number of insertions a gold contact (on a
PCB) can hold until it is no longer

reliable (or wears out)?

Alain




_______________________________________________

Alain Giguere
Quality Department
Matrox Electronic Systems LTD.

Tel: (514) 969-6000 ext.2978
e-mail: [log in to unmask]

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