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February 2000

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 8 Feb 2000 14:25:30 +0100
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text/plain
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Thanks Juice, I´m hereby sending you an admiring BRAVO MAESTRO, very good pages / Ingemar

-----Original Message-----
From: joyce [mailto:[log in to unmask]]
Sent: den 8 februari 2000 12:25
To: [log in to unmask]
Subject: Re: [TN] Chip mounting criterion


check these guys...(you may have to talk to them.  the web site infor are
limited).
http://www.aitechnology.com/enter.html
                                       jk

At 09:02 AM 2/8/00 +0100, you wrote:
>Hi TrekNetters, may I use your wisdom for a second or two. We silverepoxy
mount large GaAs chips with PP and the capillary forces pulls the epoxy all
the way up the chip' s side (chip thickness 120um), not climbing over the
mask line, luckily. So, the chip looks like a drowning sailor, epoxy all the
way up to the very topside edge. I don't like it, because of silvermigration
risks, possibly also increased electrical field strength.  Acceptable,
people mean here, but I want to fight that. If anyone has arguments, please
put them into the fiber and blow them to me instantly. Anyone from NG, TI,
MOTA, TriQuint making or mounting GaAs?
>En garde and best regards
>Ingemar Hernefjord
>Ericsson Microwave Systems
>
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