Tenison,

Use some sort of rigid carrier, preferably CDM material, to carry the board
through the p&p and reflow processes. You'll need to work on the carrier
design to ensure that you don't shadow areas of the board but it can be done
fairly easily.

I think you'll find this is how most flex assemblers overcome similar
problems, it's certainly what I used when I worked in flex assembly.

Martin Christie

===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
23/02/00 22:42
>Techies,
>
>I need help!!!
>
>I have 0402 parts on a .031" board.
>
>I use a Multitroniks 6000 pnp machine.
>
>Production says the parts keep popping off the boards because they are so thin.
>They claim it does not matter how small the flat is, they cannot place 0402 on
>.031 material.
>
>I believe this can be done.
>
>How do you handle this situation?
>
>Tenison Stone
>Telex Communications
>Blue Earth, MN
>
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