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February 2000

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Subject:
Re: Solder mask failing tape test.. -Reply
From:
TPE Engineering TechNet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Feb 2000 08:17:59 -0800
Content-Type:
text/plain
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text/plain (22 lines) 
Steve,
Another option is that the boards may not have been
completely dry prior to the application of the solder mask.
Moisture in vias can contribute to lifting mask at those
locations after the solder mask process has been
completed.
Ron Hayashi

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