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February 2000

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Subject:
From:
"Carano,Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Feb 2000 16:21:25 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (149 lines)
Dear Darrel,

You mention IWT as a potential replacement for OSP. What issues are you
having with OSP that are causing you to look elsewhere? Or, are you just
looking at a second source/

Thanks,

Mike

        -----Original Message-----
        From:   Darrel Therriault [SMTP:[log in to unmask]]
        Sent:   Thursday, February 10, 2000 3:16 PM
        To:     [log in to unmask]
        Subject:        Re: [TN] White Tin PWB

        Carey,

        I'm curious......are you taking issue with the naming of the process
or the
        process itself??

        If you think IWT is not a good finish process, please elaborate.  I
am in
        the process of qualifying
        it as a potential replacement for OSP and would like to get all the
        data/opinion I can.

        Regards..........DT




        At 09:34 AM 2/10/00 -0800, you wrote:
        >Every time I see "White Tin" as a process, I get queezy.
        >
        >For the record, white tin is a metallurgical form of tin.  The
company (I'll
        >not name) that is trying to capitalize on using it as a process
name has
        >bastardized terminology.  Of course, your other choice is gray tin
which is
        >unstable with poor properties and forms at low temperatures.  So
all of you
        >are using white tin, whether you know it or not.  Otherwise, you'd
be out of
        >business.
        >
        >I'm sorry...  I just had to get it off my back.
        >
        >Carey
        >
        >-----Original Message-----
        >From: Jorge A Rodriguez <[log in to unmask]>
        >To: [log in to unmask] <[log in to unmask]>
        >Date: Thursday, February 10, 2000 8:07 AM
        >Subject: [TN] White Tin PWB
        >
        >
        > >We are about to start using immersion tin PWBs (white tin) ,  the
boards we
        > >currently use are HASL and OSP. Are there any changes with the
SMT process,
        > >component termination finish or reflow process when white tin
boards are
        >used. I
        > >know that white tin provides a better pad finish than HASL,
similar to OSP,
        >but
        > >wihout the organic coating.  Any comments.
        > >
        > >
        > >Any iformation would be appreciated.
        > >
        > >
        > >Jorge Rodriguez
        > >Process Engineer
        > >Conexant Systems Inc
        > >
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