TECHNET Archives

February 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 7 Feb 2000 13:45:06 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines)
In a message dated 02/06/2000 5:54:02 AM Central Standard Time,
[log in to unmask] writes:

<< Could someone tell me what the standard is regarding immersion of PEM's in
the solder wave?  Addition comments would be welcome.

 Thanks

 Hank >>

Hi again Hank!

Here's a link for you discussing the affect the board assembly process has on
PEM's including wave soldering...this is from a NASA and space applications
point of view. This was also written back in 1995...not too long ago. Go to:

http://misspiggy.gsfc.nasa.gov/ctre/act/techdocs/pems/pem.htm

Then click on number 7 (Board assembly effects).

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2