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February 2000

TechNet@IPC.ORG
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Sender:
TechNet <[log in to unmask]>
X-To:
Adeodato Vigano <[log in to unmask]>
Date:
Tue, 29 Feb 2000 07:41:47 -0500
Reply-To:
[log in to unmask]
Subject:
Re: Surface prep before soldermask
From:
Dave Brown <[log in to unmask]>
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multipart/alternative; boundary="------------8F16385F256CE7688383CDFC"
Organization:
RexCan Circuits, Inc.
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text/plain (1159 bytes) , text/html (2173 bytes)

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