A current design in our CAD department has vias inbetween BGA pads. They want
to tent the vias. I was thinking
of covering half of the pad of the vias with solder mask to increase the solder
mask wall between a via and solder pad
while still leaving the via open.
Otherwise I have a question concerning via tenting. I know that the best
situation is to leave the vias open. I know that you
shouldn't tent only one side to avoid possible entrapment of flux. I know that
if you tent both sides there is a
chance of blow-out. What exactly happens to the PCB if there is blow-out and
what is the actual cause of via blowout.
Thank you.
Best Regards,
Mike Forrester
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