I would be interested in a copy.
Al Cash
[log in to unmask]
-----Original Message-----
From: David Suraski - AIM [mailto:[log in to unmask]]
Sent: Tuesday, February 01, 2000 7:59 AM
To: [log in to unmask]
Subject: Re: [LF] Solderability test results obtained with lead-free alloy s
Hello,
I have some comparative wetting testing (curves) of tin/silver/copper alloys
with silver loads of 1%, 2.5%, and 3.5% (and no, CASTIN is not included in
these!). I will forward this to Mr. Huck. If anyone would like to see this
as well, I would be happy to email the file (1.15 meg) to you.
Best regards,
David Suraski
AIM
----- Original Message -----
From: Michel Leuchtmann <mailto:[log in to unmask]>
To: [log in to unmask] <mailto:[log in to unmask]>
Sent: Tuesday, February 01, 2000 8:47 AM
Subject: Re: [LF] Solderability test results obtained with lead-free alloy s
Hello,
You will find, on the Multicore site,
http://www.multicore.com/default.htm <http://www.multicore.com/default.htm>
an interesting report on their lead free solder, paste and wire.
By following the lead-free links, you will reach the report
http://www.multicore.com/datasheets/msl733.pdf
<http://www.multicore.com/datasheets/msl733.pdf> in which is detailed (page
2) the wetting time of their ECOSOL lead-free solder compared to the
Sn60Pb40.
A precedent Email in the IPC lead-free forum also gave this address:
http://www.lead-free.org/ <http://www.lead-free.org/>
which contains an interesting cross table alloys/suppliers (quite
extensive). Some suppliers probably have reports as you look for (Multicore
do).
Regards.
P.S.: I have no actions in Multicore.
Michel Leuchtmann
Design for Environment
Tel: 33 01 39 44 56 23, ESN 579 56 23
Fax: 33 01 39 44 50 16, ESN 579 50 16
-----Message d'origine-----
De: Walter Huck [SMTP:[log in to unmask]]
Date: mardi 1 février 2000 13:59
À: [log in to unmask]
Objet: [LF] Solderability test results obtained with lead-free alloys
Dear colleagues,
our German standardization committee has lauched a task force to study the
influence of lead-free soldering processes to the content of existing
standards,
especially those describing test methods and evaluation critieria for
solderability and resistance against soldering heat test.
Previous investigations have shown that there will be differences in
wetting
behaviour compared to SnPb solder, which actually is used for these tests.
Has anybody already done such investigations, or has information or
links to
reports etc. ?
Walter Huck, Murata Electronic
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with following text in the body:
To subscribe: SUBSCRIBE Leadfree <your full name>
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################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.leadfree.org ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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