----- Original Message -----
From: Charles E McMahon <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, February 20, 2000 11:27 PM
Subject: Re: [TN] [LF] Components


> Paul;
>
> ENTEK is an OSP (anti-oxidant) used to coat bare copper boards prior to
> assembly.
> Upon exposure to reflow temperature it loses its capability to prevent
> copper tarnish and needs to be reapplied if you want to stop oxidation.
> Normally applied at the board shop after mask.
>
> Charlie McMahon
>
>
> ----- Original Message -----
> From: Paul Klasek <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Sunday, February 20, 2000 5:21 PM
> Subject: Re: [TN] [LF] Components
>
>
> > Helps indeed , thx Doug, knew the Nortel (2.5 years in field is not much
> > [yet]) & Pan.story , didn't the Castin one .
> > What does "Entek PWB pad coating" stands for ? ; organic on copper ?
> >
> > Paul Klasek
> > ResMed
> >
> > -----Original Message-----
> > From: Romm, Doug [mailto:[log in to unmask]]
> > Sent: Saturday, 19 February 2000 3:11
> > To: [log in to unmask]
> > Subject: Re: [LF] Components
> >
> >
> >
> > Paul,
> >
> > TI data on compatibility with the various lead-free pastes is limited to
> > date.  I have described our history on this issue with water-soluble and
> > no-clean Sn/Pb pastes.  I have also described what I have seen from
other
> > sources that have evaluated Ni/Pd finish components with lead-free
pastes.
> > If you want any specifics on the TI data I am glad to provide it.
> >
> > Here are my comments:
> >
> > 1. In the past, TI has conducted evaluations on Sn/Pb water soluble and
> > no-clean type pastes from various vendors.  This evaluation can be seen
> at:
>

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