Hai
I am one more of the passive technet-addicts. I need
clarifications on some Heatsink related info. I am not
focussing on thermal issues of any sort. I am more
concerned with ways of attaching it. It'd be extremely
helpful to hear from any of the experienced people
here on any of the following stuff
1. Process and reliability concerns in Heat sink &
Heat spreader attach on Flip chip packages (with and
without over mold)
2. Issues in attach materials - adhesives, phase
change, pressure sensitive tapes etc.
It will be great to receive a response from any of you
who are currently implementing or have done Heat sink
attach to packages. Please be warned of further badger
from me.
Thanks in advance
Balki
State University of Binghamton, New York
Tel : (607) 7703887
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