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January 2000

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Jan 2000 08:48:19 +1100
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Hi Rainer

could you enlighten me please: why the spot-bond , and what is the
detrimental effect occurring (?) with loose seat ?
(upon loose cooling on crystalline formations ?)
Always thought th joint is actually too robust (as those with cavities
actually live longer),
but if you say this kind of effort is worth it , than 'm missing something .
And how do you spot-bond actually (hand?)?
Would a delayed heat (quartz tube just behind wave) postpone the solidus
just long enough to freeze in peace ?
What would be the validated/qualified difference with and without (the
spot-bond)?

thanks ahead (i'd say more of us 2nd classers would be interested)

Paul Klasek
ResMed

-----Original Message-----
From: Blomberg, Rainer (FL51) [mailto:[log in to unmask]]
Sent: Thursday, 6 January 2000 3:32
To: [log in to unmask]
Subject: Re: [TN] Component Stabilizing for Wave Solder


Yes, we also build class 3 and spot-bond all thru-hole components prior to
wave solder.  Without this, there is too much part movement to assure a good
joint every time.  In our case, the effort is worth it, so we continue with
success.

R. G. Blomberg
Honeywell International
Space Systems
Staff Production Engineer
(727) 539-5534 voice
727-539-4469 Fax
[log in to unmask]



-----Original Message-----
From: Kenny Bloomquist [mailto:[log in to unmask]]
Sent: Wednesday, January 05, 2000 10:54 AM
To: [log in to unmask]
Subject: [TN] Component Stabilizing for Wave Solder


Hello Fellow TechNeters,

We build Class 3 hardware per J-STD-001 and stabilize every through hole
component prior to wave solder. I believe this is a hold over from Mil.
Spec. days and wondering if anyone else is doing this. The requirement per
J-STD-001 is to "process in a manner that precludes movement that
detrimentally affects formation of acceptable solder connections."

To stabilize or not to stabilize, that is the question.

Thank you,

Ken Bloomquist
Sr. Principal Process Engineer
PRIMEX Aerospace Company
P.O. Box 97009
Redmond, WA 98073-9709
http://www.primextech.com

Ph:   425-885-5000
FAX: 425-882-5786
[log in to unmask]

Northcon/2000, Chairman of the Board
http://www.northcon.org

Electronics Manufacturers Association (EMA), President
http://www.ema-wa.org

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