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January 2000

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 28 Jan 2000 08:33:13 -0600
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Hi Nicholas! There is some risk involved in the amount of aging you do to your
printed wiring assemblies and how much functional life you may be removing from
the product. Werner E. published a case study were some satellite electronics
were pretested to the point of causing premature failure and you can imagine
what the cost of a repair visit would have been! (hey Werner - I can't find the
reference to the article, do you have it handy?). A portion of your test
philosophy thinking should include the functional life impact of the test cycle.
Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




Nicholas LAI <[log in to unmask]> on 01/28/2000 01:34:23 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Nicholas LAI <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)

Subject:  [TN] Aging test of PCBA.



Dear, all

Is there anyone can provide information for me about the aging test of PCBA. Is
there any web site have detail information of it.

Best Regard,

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