Mike (SD)
Hey partner how are you doing?  Here is some info and a contact for info on
Flying Probe.

PROS

*       No fixture required
*       Good for prototypes
*       Can hit pads <1 mil square
*       Only method for testing MCM substrates
*       Can provide 100% nodal test on high density PCBs (BGA, CSP, TAB,
DIE)

CONS

*       Slow
*       bottleneck on high volume facility
*       vias????
*       Cannot perform leakage
*       Shorts test takes a long time
*       Requires a vision camera, and alignment system
*       Accurate fiducials
*       Excessive Bow & Twist can create problems

There are probably other pros and cons . . . etc., . . . here is the name
and address of a guy that can provide you with some great info and can help
if you want it.

Robert J. Hanson
AmeriCom Test & SMT Technology, Inc.
883 Park Ave. NE
Bainbridge Island, Washington
98110
Telephone:  206-855-9697
Fax:  206-780-0946
e:mail:  [log in to unmask] <mailto:[log in to unmask]>

Give me a call.
Ron Hollandsworth (SD)



-----Original Message-----
From: Mike Lang [ mailto:[log in to unmask] <mailto:[log in to unmask]> ]
Sent: Thursday, January 20, 2000 1:10 PM
To: [log in to unmask]
Subject: Re: [TN] Test pad size for flying probe tester


Can someone here please go into a little detail about flying probe testing.
Information such as benefits, limitations, rates, test coverage, etc would
be nice.  I know very little about them.



>>> [log in to unmask] 01/17/00 02:20AM >>>
We design for ICT testing, but need to use flying probe until the board is
stable enough to go to ICT.

Our board loading contractor is having difficulty probing our 0.032"
(0.8mm) test via's with their flying probe tester. They want us to go to
0.040" (1.0mm) pads on new designs.

Any comments?

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