Gaby

With the greatest possible respect to SIR Doug (and I really do not relish
such a challenge!) I consider that there is a way that permits / facilitates
at least a reasonable comparison.

If you process your test coupons using EXACTLY the same manufacturing
processes AND chemistries that your final production assembly will see, then
you have a pretty accurate picture of the results you can expect in
production.

We here, have been carrying out extensive SIR test projects which may well
form the basis of new "Process Validation Test" standards.

Naturally the test coupon MUST lend itself to such tests i.e.: it MUST be
able to accept component overmounting of the test patterns so that you can
best mimic production circumstances.

Of course if you were able to make available a redundant area underneath
components the could be home for a test site/pattern, then you have the
better circumstance.

I hope this helps but will be pleased to elaborate further if you wish?

Solder paste height? As with Doug - outside my knowledge zone.

Regards,
Graham Naisbitt

[log in to unmask]

WEB: http://www.concoat.co.uk

CONCOAT Ltd
Alasan House, Albany Park
CAMBERLEY GU15 2PL UK

Tel: +44 (0) 1276 691100  Fax: +44 (0) 1276 691227
----- Original Message -----
From: Bogdan Gabi <[log in to unmask]>
To: <[log in to unmask]>
Sent: 17 January 2000 09:06
Subject: [TN] SIR TESTING


> Hi, TechNetters!
> How do you correlate SIR tests on coupons with real assemblies?
> Do many of you perform these tests on a regular basis?
> Thinking about buying a SIR tester.....?????
> And more: Do you check solder paste height? How often?
> Thinking about buying a height tester too...???
> Thank you,
> Gaby
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
> information.
> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
> 847-509-9700 ext.5365
> ##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################