TECHNET Archives

January 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Jan 2000 15:40:06 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (40 lines)
Hi-dee ho ya'll!

Gotta question, I gotta a lil' board here (.68" X 4.18") that is double-sided 
(all SMT no through-hole) and has a 256-ball µBGA on one side. It's a 
prototype right now (we're only building 5 or 10 assemblies). 

In my panelization recommendations I was thinking of having the panel made 
with the boards alternating top/bottom/top/bottom etc., that way I would only 
need one stencil, and we would only have to do one machine set-up when 
building the panels, because we would be building both the top and bottom at 
the same time. Once one side of the panel is built, you just take it from the 
reflow oven and put it back into the printer to do the second side of the 
panel, but you wouldn't have to change a thing on the printer or pick and 
place machines because the bottom of the panel is an exact mirror of the 
top...follow me?

Anyways, my real question is about double-sided reflow of the µBGA, I know 
the surface tension will be there to hold the part, but I've never done it 
before and don't know for sure if there will be any problems...I wouldn't 
think so, but I though I'd ask ya'll to see if any of you have ever done it, 
and if there were any problems.

Thanks ya'll!

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2