Good afternoon technetters,

I am looking for maximum strain values that individual surface mount
components (BGA, QFP, discretes) can withstand.  I have come across many
studies surrounding solder joint failure due to CTE mismatch.  Perhaps
some of these results can be of use with a little playing around, but I
am interested in comparing strains induced through handling and
manufacturing processes to maximum strains that certain components can
see before solder joint failure.  Strains leading to brittle fracture
are of primary interest since they would represent a maximum allowable
induced strain, but any data on creep and fatigue is also of interest.
I understand that creep and fatigue involve many variables in practice
(temperature, time, stress level) but any insight as to possible sources
of such information would be greatly appreciated.

Thanks

Breton Fleming
New Product Introduction
Newbridge Networks Corporation
Kanata, Ontario, Canada

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