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January 2000

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Subject:
From:
Jan Satterfield <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Jan 2000 08:31:27 -0700
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text/plain (74 lines)
Ok..so what are the causes of solder beads??

> -----Original Message-----
> From: Kinol, Vince [SMTP:[log in to unmask]]
> Sent: Wednesday, January 19, 2000 6:17 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Reflow soldering >>> Solder balls
>
> Jens,
> I believe the TechNet archives will have some detail on solder balls. In
> general there are a few causes for the formation of solder balls.
> Environmental exposure of the paste to moisture, this can be from high
> humidity, extended queue times after printing or exposure of below room
> temperature paste to room temperature air. (ie paste is below dew point)
> Another cause would be oxidation of the solder alloy. This may exist in
> the
> paste or be formed during the reflow process, due to the profile not being
> optimized to the flux.
> Also just a note solder balls are very small and should not be confused
> with
> solder beads, large coalesced solder found at times at edges of caps and
> resistors.
>         Feel free to contact me off line for more details.
> VBK
> Vincent B. Kinol CQE [log in to unmask] <mailto:[log in to unmask]>
> Applications Engineer OMG Americas Microbond
> Phone 919-544-8090 x298 FAX 919-544-7996
>
>
>         -----Original Message-----
>         From:   [log in to unmask] [SMTP:[log in to unmask]]
>         Sent:   Tuesday, January 18, 2000 11:16 PM
>         To:     [log in to unmask]
>         Subject:        [TN] Reflow soldering >>> Solder balls
>
>         Hi,
>
>         sorry for this basic basic question!
>         Are there any resources for the solder balls problem? Where do the
> come from and how to prevent them?
>         Is there any site for solder defects info ?
>         regards
>         Jens Behrens
>
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