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January 2000

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Subject:
BLIND VIAS IN PADS
From:
Brunker Ed <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Jan 2000 08:52:50 -0000
Content-Type:
text/plain
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text/plain (24 lines) 
We use blind resin filled vias in pads for micro BGA devices. With one
particular fabricator, we experience dimples in the pads where the resin has
been scavenged out and then plated on top. I have been charged with the task
of defining the specification for how flat the pads should be. Any help on
this one?
Regards
Edward Brunker
Principal Process Engineer
Sendo

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