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January 2000

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Subject:
Re: Backplane: Surface finish -Reply
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Jan 2000 00:36:33 +0200
Content-Type:
text/plain
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text/plain (42 lines) 
Hi, TechNetters!
We had about 2 years ago frequent discussions about the reliability of gold/nickel
plating on backplanes for press fit. I don't remember if what the pro and con's were. I
would like to know if connector manufacturer's are giving in their specs the required
drill size for gold finish or OSP, what the finish of the connector pins should be, and
if switching to another finish  changes insertion forces, gas tightness, and other.
Gaby

TPE Engineering TechNet wrote:

> I would suspect easier control of hole size with either NiAu
> or Entek coatings on the boards. There may be more
> variation in hole size with HAL.
>
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