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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 17 Jan 2000 13:06:19 -0600 |
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I'll second that, because I've burned a lot of hours attempting to solve
this one, without success, for the reasons noted in my original post to
Bill.
Regards - Kelly
-----Original Message-----
From: Ryan Grant <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, January 17, 2000 12:24 PM
Subject: Re: [TN] VIAS IN PAD
>Steve,
> Most of us are of the opinion that vias in surface mount pads are a
>bad deal. If you have a successful process, how about sharing it with the
>rest of us?
>
>> -----Original Message-----
>> From: Joy, Stephen C [SMTP:[log in to unmask]]
>> Sent: Monday, January 17, 2000 8:39 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] VIAS IN PAD
>>
>> Bill,
>> I have a successful process for this. Please contact me off line for
>> details.
>> Steve
>>
>> -----Original Message-----
>> From: Bill Robinson [mailto:[log in to unmask]]
>> Sent: Monday, January 17, 2000 6:14 AM
>> To: [log in to unmask]
>> Subject: [TN] VIAS IN PAD
>>
>>
>> We have pruchased a PWB design for use in one of our products. This
>> design
>> has through vias in the surface mount pads. Has anyone had experience
>> with
>> this situation? My first concern is losing solder through the via during
>> reflow. Is there a good way to fill the via and still have a good solder
>> joint? And what other kinds of problems can we expect? thanks for the
>> help.
>>
>> Bill Robinson
>>
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