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January 2000

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 Jan 2000 11:13:59 -0700
Content-Type:
text/plain
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text/plain (81 lines)
Steve,
        Most of us are of the opinion that vias in surface mount pads are a
bad deal.  If you have a successful process, how about sharing it with the
rest of us?

> -----Original Message-----
> From: Joy, Stephen C [SMTP:[log in to unmask]]
> Sent: Monday, January 17, 2000 8:39 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] VIAS IN PAD
>
> Bill,
> I have a successful process for this. Please contact me off line for
> details.
> Steve
>
> -----Original Message-----
> From: Bill Robinson [mailto:[log in to unmask]]
> Sent: Monday, January 17, 2000 6:14 AM
> To: [log in to unmask]
> Subject: [TN] VIAS IN PAD
>
>
> We have pruchased a PWB design for use in one of our products.  This
> design
> has through vias in the surface mount pads.  Has anyone had experience
> with
> this situation?  My first concern is losing solder through the via during
> reflow.  Is there a good way to fill the via and still have a good solder
> joint?  And what other kinds of problems can we expect?  thanks for the
> help.
>
> Bill Robinson
>
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