Hello and Happy New Year
I am a student currently investigating the solder joint response of
individual components (QFP, BGA, passives, etc.) to PWB flexure induced
throughout the manufacture, installation and use of large format
boards.  Of particular interest are maximum strain values, shear and
tensile stress values,
creep rates, and any other endurance limits for individual components.
I would appreciate any information as to possible sources for this type
of information and anything else that may be available.
Thankyou
Breton Fleming

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