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January 2000

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Subject:
From:
"Joy, Stephen C" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 Jan 2000 07:38:36 -0800
Content-Type:
text/plain
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text/plain (50 lines)
Bill,
I have a successful process for this. Please contact me off line for
details.
Steve

-----Original Message-----
From: Bill Robinson [mailto:[log in to unmask]]
Sent: Monday, January 17, 2000 6:14 AM
To: [log in to unmask]
Subject: [TN] VIAS IN PAD


We have pruchased a PWB design for use in one of our products.  This design
has through vias in the surface mount pads.  Has anyone had experience with
this situation?  My first concern is losing solder through the via during
reflow.  Is there a good way to fill the via and still have a good solder
joint?  And what other kinds of problems can we expect?  thanks for the
help.

Bill Robinson

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