We have pruchased a PWB design for use in one of our products.  This design
has through vias in the surface mount pads.  Has anyone had experience with
this situation?  My first concern is losing solder through the via during
reflow.  Is there a good way to fill the via and still have a good solder
joint?  And what other kinds of problems can we expect?  thanks for the help.

Bill Robinson

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