Wire Bond Strength Test Methods:

Mil-Std-883, Method 2011:  Destructive Bond Pull Test
Mil-Std-883, Method 2023:  Nondestructive Bond Pull
Mil-Std-750, Method 2037:  Bond Pull
available at:  http://www.dscc.dla.mil/

IPC:
IPC-TM-650, Method 2.4.42.3:  Wire Bond Pull Strength
available at:  http://www.ipc.org

Within these specs there is reference to wire diameter and material (Au or
Al), but no mention that I can see of interconnect metalization.  You might
want to be cautious of Kirkendall voiding (purple plague), but I'm sure you've
taken that into consideration.  There's data archived on TechNet and you can
find a lot on the web.  Here's one I just looked up just to make sure I could
spell it right (http://www.eccb.org/pbps/tg/wirebond.htm)

Sorry, not familiar with NASA.

Glenn

Rusty Boyd <[log in to unmask]> Wrote:
|
| I'm searching for published standards for ultrasonic Al wire bonds on Au
| - Ni - Cu pads. I would prefer mil spec and or NASA specs as the project
| we are working on has to work reliably for 10 years without maintenance.
| I have tried IPC and IEEE on line with no luck.
| TIA,
| Rusty
|
| Rusty Boyd
| OUHEP - http://oua4.nhn.ou.edu/
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