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January 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Jan 2000 21:12:11 EST
Content-Type:
text/plain
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text/plain (51 lines)
In a message dated 01/12/2000 6:31:58 PM Central Standard Time,
[log in to unmask] writes:

> Does anyone have any suggestions as to what they
>  prefer in creating micro vias? Laser drilling (YAG or
>  CO2) or Photo Dielectrics? Pros and cons? Any websites
>  or companies to find out more info would be
>  appreciated.
>
>  Jack Petyak
>  EP Technologies

Hi Jack!

I can't recommend one process over the other, but I can point to some web
sites:

http://www.ipc.org/html/hdi.htm
http://www.plasmaetch.com/microvia.html
http://www.ewh.ieee.org/soc/cpmt/newsletter/199906/cork.html
http://www.photomachining.com/via.html
http://www.mf.polyu.edu.hk/pctech/alternatives%20main.htm
http://lfw.pennwellnet.com/home/home.cfm
http://www.isdmag.com/Editorial/1998/Packaging9808.html
http://www.ncms.org/3portfolio/2SIGs/NIST-MMII.htm
http://www.sheldahl.com/nfta1.html
http://www.hadco.com/typei.htm
http://www.powerckts.com/press/press2.htm
http://www.dyconex.com/html/whats_new/whats_new_9903.htm
http://www.dupont.com/pcm/hot/presdry.html
http://www.itri.org/html/MVCostAnalysis.htm
http://searchpdf.adobe.com/proxies/1/15/64/30.html

This might keep ya' busy for a while...

-Steve Gregory-

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