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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 11 Jan 2000 21:23:43 -0500 |
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I've used several kinds. Pumice, microetch and a acid soap. I liked
the pumice the best. However its been several years since i used it.
The only difficulty I remember having was with thin core and .5 oz
copper. Core thickness of .006" or less we couldn't run. I'm sure
improvements have been made since then. Currently running microetch in
conveyorized equip. and core thickness is not an issue. We can run
.002" cores with .5/.5 cu.
Mike Doty
Hadco TCE
______________________________ Reply Separator _________________________________
Subject: [TN] Panel Prep
Author: Wayne Martin <[log in to unmask]> at smtplink-hadco
Date: 1/11/00 3:38 PM
Still looking for additional feedback as to what is the perfered method for
cleaning cores before dry film lamination.
Any information would be appreciated.
Thank you
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