Hello Jean-Fran=E7ois,

Sampling size depends on the product class and reliability you require =
for
the
application of the material. For FAB boards, IPC-6012 gives a pretty
detailed
list for inspection requirements. There is, I think, a similar =
requirement
for
assembled boards. We occasionally do a lot more test on returned boards =
than
on new boards. This process is done in order to find the root cause of =
the
defects.
We fully document what criteria we are looking for in a series of =
internal
documents based on the IPC specifications, Mil Standards and NASA
Specifications.
Before any of us submit an example, it would help greatly if you would
specify
if you are talking about Fab board or assembly testing.

Hope this helps,

Alain Savard, B.Sc.
Chemical Process Analyst
CAE Electronics Ltd.
e-mail: [log in to unmask]

-----Original Message-----
From: Jean-Francois Bissonnette
Subject: [TN] Inspection methods

I would need the help from the poeple that do board
inpections.

1)  When You inspect a batch of new boards, what is the percentage of =
boards
that you  inspect?
2)  Do you inspect a board that comes back from repair the same way you
inspect a new board?
3)  Do you have a standard check list to guide the inspections?
4)  If so, is it possible to have an example of it?

JF

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