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January 2000

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Subject:
Re: VIAS IN PAD
From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 17 Jan 2000 16:04:52 +0100
Content-Type:
text/plain
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text/plain (47 lines) 
Hi Bill,

You need to compensate the amount of solderpaste with two times the volume of the via. You can do this by increasing the stencil thickness and/or by making the apertures a little larger than the pads. With 10 mil overprinting the overprinted paste will flow back onto the pads.

Hope this helps....

Daan Terstegge
Unclassified mail


>>> Bill Robinson <[log in to unmask]> 01/17 3:14 pm >>>
We have pruchased a PWB design for use in one of our products.  This design
has through vias in the surface mount pads.  Has anyone had experience with
this situation?  My first concern is losing solder through the via during
reflow.  Is there a good way to fill the via and still have a good solder
joint?  And what other kinds of problems can we expect?  thanks for the help.

Bill Robinson

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