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January 2000

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From:
"Kasprzak, Bill (esd) USX" <[log in to unmask]>
Date:
Wed, 5 Jan 2000 16:03:06 -0500
MIME-Version:
1.0
X-To:
Kenny Bloomquist <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Kasprzak, Bill (esd) USX" <[log in to unmask]>
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Ken:

We use water soluble mask as a means of holding parts steady during wave
soldering. Basically we build the board and apply a bead of material over
all of the axial parts or where ever we can get a hold down point. We are
also building class 3 hardware.

Bill Kasprzak
Moog Inc.

> -----Original Message-----
> From: Kenny Bloomquist [SMTP:[log in to unmask]]
> Sent: Wednesday, January 05, 2000 10:54 AM
> To:   [log in to unmask]
> Subject:      [TN] Component Stabilizing for Wave Solder
>
> Hello Fellow TechNeters,
>
> We build Class 3 hardware per J-STD-001 and stabilize every through hole
> component prior to wave solder. I believe this is a hold over from Mil.
> Spec. days and wondering if anyone else is doing this. The requirement per
> J-STD-001 is to "process in a manner that precludes movement that
> detrimentally affects formation of acceptable solder connections."
>
> To stabilize or not to stabilize, that is the question.
>
> Thank you,
>
> Ken Bloomquist
> Sr. Principal Process Engineer
> PRIMEX Aerospace Company
> P.O. Box 97009
> Redmond, WA 98073-9709
> http://www.primextech.com
>
> Ph:   425-885-5000
> FAX: 425-882-5786
> [log in to unmask]
>
> Northcon/2000, Chairman of the Board
> http://www.northcon.org
>
> Electronics Manufacturers Association (EMA), President
> http://www.ema-wa.org
>
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